Bondexpo

October 9-12, 2017: Stuttgart, Germany

Discover automated metering and mixing technology from DOPAG

Future-oriented metering and mixing technology is increasingly focusing on automated solutions that can be efficiently integrated into existing or new automated production processes. DOPAG offers comprehensive solutions for process-integrated, automated bonding and sealing, whether it is a stand-alone solution or a line-integrated production cells.

Discover our automation solutions live at our booth and learn more from our experts about our portfolio for automated application of adhesives and sealants.

Convince yourself of DOPAG automation solutions and visit us at Bondexpo 2017, the leading trade fair for bonding technology.

Come and see us personally at our booth:

October 9-12, 2017
Hall 6 / Booth 6.427
New Stuttgart Exhibition Centre
Germany

If you need information or would like to make an appointment? Please contact us:
Phone: +49 621 3705-500
Email: marketing(at)dopag.de

Learn more about the innovative solutions by DOPAG. Our key application managers and market managers are looking forward to your visit.

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